Hx Nitro’s Internet of Things (IoT) received a warm reception from Maplejet visitors at the Pack Expo International during the second day of exhibition at McCormick Place, Chicago, Illinois, USA.
Maplejet CEO (center) Speaks with Key Partners During the Second Day of Pack Expo Chicago 2018
The second day of exhibition was packed with visits from various product manufacturers and meetings with key partners. The visitors were particularly interested in the ability of Hx Nitro to promote Internet of Things (IoT) and Wi Fi connectivity in the production line. This will enable production operators to access printer’s status and print parameters via specific IP Address. Other features include printer’s fast drying ink, superior print quality, printer’s simplicity and flexibility, and its overall workmanship.
Hx Nitro is geared to increasing worldwide presence with a strong support from key partners and great interest from potential printer distributors specially in the South American market.
ABOUT PACK EXPO INTERNATIONAL
Pack Expo International is one of the biggest exhibitions on Packaging Industry across the globe. It is graced by more that 50,000 visitors with 2,500 exhibitors showcasing their company’s cutting-edge technology on packaging and printing industry. This year’s Pack Expo International was held at McCormick Place, Chicago, Illinois from October 14-17, 2018.
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